Excellite
Series
Wafer Semi Conductor Plating
Tools
PSI's
plating tools are specifically
designed for electrolytic
wafer plating of silicon,
gallium arsenide, and
similar glass-type
substrates.
Patented
plating cell configurations
utilize a rotating
cathode, along with
reciprocating anodes
(9000 series) or carousel
assembly (8000 series).
During plating, as
the wafer rotates about
the anode, the center
portion of the wafer
receives greater exposure
to the anodes.
The
diagram at the right
illustrates the cumulative
anode center line path,
traced relative to
a wafer when the system
is operated at a speed
ratio of (7) anode
cycles per (9) rotations
of the fixture wheel.
The 9000 series
tools utilize a reciprocating
anode assembly (assembly
traverses back and
forth while the wafer
rotates).
The 8000 series
tools utilize a carousel
assembly to move the
wafers around center-mounted
anodes, while the wafers
themselves rotate.
Plating
Tools Available
Excellite
EXP | Excellite
9001 | Excellite
8001 | Excellite
8002
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