Excellite FSP

The Excellite FSP is a roll-to-roll, continuous strip, electroplating, and wet processing system designed principally for flex circuits, RFID, and thin film PV solar applications while having a variety of other electronics and metal finishing applications.

This system is uniquely capable of handling delicate flexible substrate materials without handling damage frequently resulting from alternative designs.

Offering plating uniformity through a unique contact design, combined with the close proximity segmented anodes, the uniformity is unsurpassed in the industry. Additionally anodes are segmented to enable best surface distribution also with thin copper conducting layer. The Excellite FSP enables copper plating thickness ensuring ± 5% surface distribution with copper conducting layer.

Main benefits for the end user

Best throw in blind micro-vias
Controlled plating thickness; at hole edges and in the hole
Highest current densities attainable
Compatibility with ultra-thin base copper
Production proven with ultra thin foils
Highest process reliability
Reduced maintenance
Capable for BMV and through-hole filling
No down time for anode maintenance
Fully adjustable current shields
Auto strip-width adjustability
Constant anode conditions

Technical advantages

Fully adjustable anode/cathode distance/shields
Combination of inert DSA insoluble segmented anodes
Contact systems that won’t plate up
Low maintenance coupled with high reliability
Uniform plating thickness on the surface, in the holes and in blind-vias
Ultra-fine line capability
Uniform surface thickness

Read the complete Excellite FSP Brochure.

Contact Precision Process today to learn more about advanced plating systems.