Semi-Conductor
  Wafer Plating Tools
   
       
   
   


Excellite EXP
Wafer Plating Tool

Features

• Automatic or Manual Operations

• 50-300 mm Wafer Capability

• Underbump Metalization Applications

- MEMS
- OEMS
- MOEMS
- CMOS

 

 
 
Precision Process has been working closely with customers to improve wafer-processing efficiency. The new EXP series is designed with the smallest most efficient layout design in the industry. The EXP using a 3 axis automated wafer transport system allows all chemical processes in the rear and all rinsing in the front. This design results in a footprint 1/2 the length of conventional linear systems, saving valuable clean room floor space. The EXP transporter is clean, fast, smooth, and accurate in positioning fragile wafers. The EXP is available with multiple transporters as well as linear transporters.