Excellite 9001 Wafer
Plating Tools

The Excellite 9001M wafer plating tool is designed around a unique, patented plating cell configuration combining planetary and orbital type movements. These actions provide the foundation for plating uniformity.

The 9001M features one plating vessel designed to plate a single wafer at a time. A high precision pulse DC power supply provides rectification.

Standard components include a heated dragout rinse, a quick dump rinse air aspirator, DI water spray gun, and a nitrogen spray gun. The basic tool comes with microprocessor-based controls for such parameters as heat, time, filtration, and fill/dump cycles. Additional control options are available in a PLC with touch screen, as well as full PC-based control with touch screen, data acquisition, and real-time trending.

External carboy dump tanks are available for waste, as well as a resin-based reclaim system for precious metal reclaim