Excellite 8002
Wafer Plating System
Dual Cell Version

The Excellite 8000 series wafer plating systems are designed around a unique plating tank configuration which combines planetary and orbital type movements. These actions provide the foundation for plating uniformity.

The Dual Cell Version features two plating vessel, with the capacity of plating up to eight wafers at one time. Multi-channel DC power supplies allow the operator to adjust the required milliamp current to each individual wafer.

The system comes standard with two dragout rinses, a quick dump rinse, and a glove wash. Nitrogen blow-offs and DI spray guns are included.