Electroplating MEMS, Semiconductors, and Wafers
For the semiconductor and MEMS (Micro Electro Mechanical Systems) industries, Precision Process Inc. provides electroplating equipment specifically designed for electrolytic and electroless wafer electroplating of silicon, gallium arsenide, and similar glass-type substrates.
Precision Process provides wafer electroplating equipment with a tri-axis robot. This compact, efficient design reduces the floor space required, allowing you to produce more at less cost. Learn more about the Excellite Wafer Plating Tools.
For electroplating MEMS and Semiconductors Precision Process provides:
- Equipment for electrolytic and electroless electroplating of semiconductor wafers
- A state of the art clean room for electroplating equipment manufacturing
- Automated tri-axis pick-and-place systems with small footprints that save valuable floor space and reduce costs
- Electroplating tools that meets performance criteria
- Electroplating tools with minimal operator involvement due to microprocessor control and FOUP to FOUP processing.
Contact Precision Process for more information electroplating MEMs and semiconductors.
