Electroplating Systems for Flexible Display, RFID Systems, Solar Systems and Microelectronics
Precision Process Inc. develops cutting-edge wide web (roll-to-roll) electroplating systems that move flexible displays, radio frequency identification (RFID) systems, solar cells, and microelectronics to the next level.
Introducting Excellite FSP
Excellite FSP is a roll-to-roll (R2R), continuous-strip electroplating and wet processing system designed for flexible circuits, RFID, and solar cells.
Designed to handle delicate materials, Excellite FSP has been successfully installed at several US-based electronics firms. Download the Flexible Substrate Plating Technology Brochure for more information.
Proven plating uniformity
With its unique contact design and close-proximity segmented anodes, Excellite offers production-proven plating uniformity.
Blind micro-via capability
The plating cells incorporate plating-solution flooding and solution-flow with a unique volume pressure to give Excellite FSP blind micro-via capability.
Surface topography
The Excellite FSP with segmented anodes allows copper-plating thickness that ensures +/- 5 % surface distribution with the copper conducting layer.
Via filling
Excellite FSP offers BMV and through-via filling with a combination of inert anode and soluble anodes that provide low maintenance and high productivity.
Excellite FSP offers many more benefits:
- Controlled plating thickness
- Highest current densities attainable
- Compatible with ultra thin foils
- Highest process reliability
- Reduced maintenance
- BMV and through-hole filling
- No down time for anode maintenance
- Fully adjustable current shields
- Auto strip-width adjustability
- Constant anode conditions
Contact Precision Process to learn more about Excellite FSP for RFID, flexible displays, solar cells, and microelectronics.
