Electroplating Systems for Connectors, Integrated Circuits, and Lead Frames
For manufacturers of connectors, integrated circuits, and lead frames, Precision Process Inc. offers time-tested reel-to-reel (R2R) electroplating systems for selective electroplating.
Precision Process specializes in selective electroplating equipment including, selective depth, proximity spray cells, belt cells, and spot-plating cells of several different designs.
Precision Process can plate tin and precious metal spots in the same horizontal plane on a strip of connectors, potentially reducing die width and saving base material for new contact designs. Selective electroplating equipment can pinpoint precious metal wherever you need it, reducing waste, allowing efficient design of parts, and ultimately saving you money.
Precision Process provides:
- Spot electroplating equipment that allows tin and gold electroplating in the same horizontal plane, significantly reducing base metal usage and die width for new contact designs
- Electroplating equipment with less operator involvement due to extensive use of microprocessors, hard tooling, and our proprietary software
- Turnkey electroplating equipment with minimal startup issues
- Quick to build electroplating equipment that reduces lead times
Read our Selective Plating Brochure for more details on Selective and Spot plating.
Contact Precision Process to learn more about electroplating equipment for connectors, integrated circuits, and lead frames.
