Accuplate 3D CAD Plating Solids Mathematical Modeling

AccuPlate 3D™ CAD Plating Software includes an electrochemical database to store the properties of the electrolytes in the plating process. Data such as conductivity, cathodic effiency, properties of deposited metals, and cathodic/anodic polarization laws are accessed during the simulation analysis to predict the behavior of the plating process.

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