What
is Accuplate 3D CAD Plating Software?
AccuPlate
3D™ CAD Plating software is a revolutionary
new application of state-of-the-art computer science
utilizing CAD, interactive solids mathematical modeling,
3D geometry, and chemical data management.
AccuPlate
3D™ CAD Plating software is capable of providing
complete electroplating cell understanding that can
be applied
to plating equipment design and optimization, plating
deposit uniformity improvement, plating speed increases,
plated metal savings, and product quality improvements.
AccuPlate
3D™ CAD Plating software can be incorporated
into current and future DFM technologies, thus decreasing
the time-to-market cycle of new electroplating designs. Electroplating
Process improvements may be made which bypass costly
trial and error plating cell
design, set-up and validation. This can be
especially useful for quick-turn plating manufacturers,
for plating products such
as printed circuit boards.
NEXT:
Electroplating
Chemical Data Management » |
|
• Plating Deposit Uniformity
• Plating Deposit Thickness
• Thieving/Shielding Design
• Anode Design and Location
• Plating Rack Design
|
|
Plating
speed improvements resulting from the use of AccuPlate
3D™ CAD Plating software can also be advantages to
large, production-oriented plating manufacturers, who regularly
face electroplating capacity restraints, or are currently
contemplating capital expenditures for plating equipment. |
